Integrated chip-size antennas for wireless microsystems : fabrication and desig...

• Author(s): Mendes, P. M. ; Polyakov, A. ; Bartek, M. ; Burghartz, J. N. ; Correia, J. H.
• Date: 2006
• Persistent ID: http://hdl.handle.net/1822/5939
• Origin: RepositóriUM - Universidade do Minho
• Subject(s): Chip-size antenna; Wireless microsystem; Wafer-level packaging; Excimer laser ablation; Via fabrication
• Document Type: Article
• Language: English

Description

This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved.