Integrated chip-size antenna for wireless microsystems : fabrication and design...

• Author(s): Mendes, P. M. ; Polyakov, A. ; Bartek, M. ; Burghartz, J. N. ; Correia, J. H.
• Date: 2003
• Persistent ID: http://hdl.handle.net/1822/1639
• Origin: RepositóriUM - Universidade do Minho
• Subject(s): Chip-size antenna; Wafer level packaging; Wireless microsystem; Laser ablation; Powder blasting
• Document Type: Conference Object
• Language: English

Description

This paper reports on fabrication and design considerations of an integrated folded shortedpatch chip-size antenna for applications in short-range wireless microsystems and operating frequency of 5.7 GHz. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Two different fabrication options based on via formation in glass substrates using excimer laser ablation or powder blasting are presented.