Integrated chip-size antenna for wireless microsystems : fabrication and design...

• Autor(es): Mendes, P. M. ; Polyakov, A. ; Bartek, M. ; Burghartz, J. N. ; Correia, J. H.
• Data: 2003
• Identificador Persistente: http://hdl.handle.net/1822/1639
• Origem: RepositóriUM - Universidade do Minho
• Assunto(s): Chip-size antenna; Wafer level packaging; Wireless microsystem; Laser ablation; Powder blasting
• Tipo de Documento: Documento de conferência
• Idioma: Inglês

Descrição

This paper reports on fabrication and design considerations of an integrated folded shortedpatch chip-size antenna for applications in short-range wireless microsystems and operating frequency of 5.7 GHz. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Two different fabrication options based on via formation in glass substrates using excimer laser ablation or powder blasting are presented.