Integrated 5.7 GHz chip-size antenna for wireless sensor networks

• Autor(es): Mendes, P. M. ; Polyakov, A. ; Bartek, M. ; Burghartz, J. N. ; Correia, J. H.
• Data: 2003
• Identificador Persistente: http://hdl.handle.net/1822/1567
• Origem: RepositóriUM - Universidade do Minho
• Assunto(s): Integrated antenna; Wireless sensor networks; Wafer level packaging
• Tipo de Documento: Documento de conferência
• Idioma: Inglês

Descrição

We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%.