Interfacial design of Cu-based composites prepared by powder metallurgy for hea...

• Author(s): Schubert, Th. ; Trindade, B. ; Weißgärber, T. ; Kieback, B.
• Date: 2008
• Persistent ID: http://hdl.handle.net/10316/4191
• Origin: Estudo Geral - Universidade de Coimbra
• Subject(s): Copper composites; Powder metallurgy; Thermal management; Heat sinks; Electronics
• Document Type: Article
• Language: English

Description

Thermal aspects are becoming increasingly important for the reliability of the electronic components due to the continuous progress of the electronic industries. Therefore, the effective thermal management is a key issue for packaging of high performance semiconductors. The ideal material working as heat sink and heat spreader should have a CTE of (4-8) × 10-6 K-1 and a high thermal conductivity. Metal matrix composites offer the possibility to tailor the properties of a metal by adding an appropriate reinforcement phase and to meet the demands in thermal management. http://www.sciencedirect.com/science/article/B6TXD-4NK4G71-1/1/50620dd9a257eaca4c01d63891e3380f