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Interfacial design of Cu-based composites prepared by powder metallurgy for hea...

Thermal aspects are becoming increasingly important for the reliability of the electronic components due to the continuous progress of the electronic industries. Therefore, the effective thermal management is a key issue for packaging of high performance semiconductors. The ideal material working as heat sink and heat spreader should have a CTE of (4-8) × 10-6 K-1 and a high thermal conductivity. Metal matrix c...