Encontrado 1 documento, a visualizar página 1 de 1
Ordenado por
Data
ir para a página:
1
Processability and electrical characteristics of glass substrates for RF wafer-...
Polyakov, A.; Mendes, P. M.; Sinaga, S. M.; Bartek, M.; Rejaei, B.; Correia, J. H.; Burghartz, J. N.Various types of glass substrates have been compared with respect to their suitability as a low-loss substrate in wafer-level chip-scale packaging for RF applications. Processability has been evaluated by fabrication of shallow and deep recesses using wet etching in HF (/H3PO4) solutions. Electrical characteristics (dielectric constant and attenuation) have been extracted from measurements on coplanar wave guid...
Data: 2003
|
Origem: RepositóriUM - Universidade do Minho
| Financiadores do RCAAP | |||||||
|
|
|
|
|
|
||