The present work reports on the fabrication and characterization of a planar Peltier cooler on a flexible substrate. The device was fabricated on a 12 νm thick Kapton(c) polyimide substrate using Bi2Te3 and Sb2Te3 thermoelectric elements deposited by thermal co-evaporation. The cold area of the device is cooled with four thermoelectric junctions, connected in series using metal contacts. Plastic substrates add ...
The present work reports the fabrication and characterization of a planar Peltier microcooler on a flexible substrate. The microcooler was fabricated on flexible Kapton© polyimide substrate, 12 µm in thickness, using Bi2Te3 and Sb2Te3 thermoelectric elements deposited by thermal co-evaporation. The cold area of the device is cooled using four pairs of thermoelectric elements, connected in series with aluminum/n...
The present work reports on the fabrication and characterization of the first planar Peltier microcooler on a flexible substrate. The microcooler was fabricated on flexible Kapton© polyimide substrate, 25 μm in thickness, using Bi2Te3 and Sb2Te3 thermoelectric elements, and was deposited by thermal co-evaporation.
The optimization of the thermal co-evaporation process for ntype Bismuth Telluride and p-type Antimony Telluride onto plastic substrates (Kapton© polyimide) for thermoelectric applications is reported.
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