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Solid-state diffusion bonding of gamma-TiAl alloys using Ti/Al thin films as in...
Duarte, L. I.; Ramos, A. S.; Vieira, M. F.; Viana, F.; Vieira, M. T.; Koçak, M.Alternating nanometric layers of titanium and aluminium were used as filler material to promote joining between titanium aluminide samples. The improved diffusivity of these nanometric layers is thought to overcome the difficulties in solid-state joining of titanium aluminides without producing chemical discontinuities at the interface. In this study, a thin multilayer (alternating titanium and aluminium layers...
Data: 2006
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Origem: Estudo Geral - Universidade de Coimbra
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