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Solid-state diffusion bonding of gamma-TiAl alloys using Ti/Al thin films as in...
Duarte, L. I.; Ramos, A. S.; Vieira, M. F.; Viana, F.; Vieira, M. T.; Koçak, M.Alternating nanometric layers of titanium and aluminium were used as filler material to promote joining between titanium aluminide samples. The improved diffusivity of these nanometric layers is thought to overcome the difficulties in solid-state joining of titanium aluminides without producing chemical discontinuities at the interface. In this study, a thin multilayer (alternating titanium and aluminium layers...
Nanometric multilayers: A new approach for joining TiAl
Ramos, A. S.; Vieira, M. T.; Duarte, L. I.; Vieira, M. F.; Viana, F.; Calinas, R.A novel intermetallic alloy diffusion bonding procedure is being developed. The innovative aspect relies on the use of sputtered nanometallic multilayers made up of the elements present in the bulk intermetallics to enhance the bonding mechanisms. For this purpose a deep knowledge of the multilayer thin films is required, focusing on thermal phase stability and grain size evolution. [gamma]-TiAl was selected fo...
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