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Nanometric multilayers: A new approach for joining TiAl
Ramos, A. S.; Vieira, M. T.; Duarte, L. I.; Vieira, M. F.; Viana, F.; Calinas, R.A novel intermetallic alloy diffusion bonding procedure is being developed. The innovative aspect relies on the use of sputtered nanometallic multilayers made up of the elements present in the bulk intermetallics to enhance the bonding mechanisms. For this purpose a deep knowledge of the multilayer thin films is required, focusing on thermal phase stability and grain size evolution. [gamma]-TiAl was selected fo...
Data: 2006
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Origem: Estudo Geral - Universidade de Coimbra
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