Document details

An effective sensor for tool wear monitoring in face milling : acoustic emmision

Author(s): Mathew, M. T. cv logo 1 ; Pai, P. S. cv logo 2 ; Rocha, L. A. cv logo 3

Date: 2008

Persistent ID: http://hdl.handle.net/1822/8392

Origin: RepositóriUM - Universidade do Minho

Subject(s): Tool wear monitoring; Acoustic emission; Inserts


Description
Acoustic Emission (AE) has been widely used for monitoring manufacturing processes particularly those involving metal cutting. Monitoring the condition of the cutting tool in the machining process is very important since tool condition will affect the part size, quality and an unexpected tool failure may damage the tool, work-piece and sometimes the machine tool itself. AE can be effectively used for tool condition monitoring applications because the emissions from process changes like tool wear, chip formation i.e. plastic deformation, etc. can be directly related to the mechanics of the process. Also AE can very effectively respond to changes like tool fracture, tool chipping, etc. when compared to cutting force and since the frequency range is much higher than that of machine vibrations and environmental noises, a relatively uncontaminated signal can be obtained. AE signal analysis was applied for sensing tool wear in face milling operations. Cutting tests were carried out on a vertical milling machine. Tests were carried out for a given cutting condition, using single insert, two inserts (adjacent and opposite) and three inserts in the cutter. AE signal parameters like ring down count and rms voltage were measured and were correlated with flank wear values (VB max). The results of this investigation indicate that AE can be effectively used for monitoring tool wear in face milling operations.
Document Type Article
Language English
delicious logo  facebook logo  linkedin logo  twitter logo 
degois logo
mendeley logo

Related documents



    Financiadores do RCAAP

Fundação para a Ciência e a Tecnologia Universidade do Minho   Governo Português Ministério da Educação e Ciência Programa Operacional da Sociedade do Conhecimento EU