Design and analysis of a 6 GHz chip antenna on glass substrates for integration...

• Autor(es): Mendes, P. M. ; Bartek, M. ; Burghartz, J. N. ; Correia, J. H.
• Data: 2003
• Identificador Persistente: http://hdl.handle.net/1822/1608
• Origem: RepositóriUM - Universidade do Minho
• Assunto(s): Chip size antenna; Antenna on glass; Antenna integration; Wireless microsystem
• Tipo de Documento: Documento de conferência
• Idioma: Inglês

Descrição

We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main issue of our work. A short-range wireless link between two systems both equipped with a 11.7x12.4 mm2 patch antenna (measured characteristics: 6 GHz central frequency, 100 MHz bandwidth @ -10 dB, 3 dB gain, 51% efficiency) realized on a Corning Pyrex #7740 glass substrate is demonstrated.